A typical DRAM
IC has address lines, data lines, and control lines. The address lines
are used to identify the location of the memory storage element(s) or
cell(s) to be read from or written to. The data lines contain
the value of the data read or being written into the memory cells
accessed. The control lines
are used to direct the sequence of steps needed for the read and write operations of the DRAM.
The memory
elements of a DRAM are arranged in an array
of rows and columns. Each row of memory cells share a common 'word'
line,
while each column of cells share a common
'bit'
line. Thus, the location of a memory cell in the array is the intersection
of its 'word' and 'bit' lines. The number of columns of such a memory array is known as the bit
width of each word.
Just like an
SRAM memory cell, a DRAM memory cell uses these 'word' and 'bit' lines for
its read and write operations. During a 'write' operation, the data
to be written ('1' or '0') is provided at the 'bit' line while the 'word
line' is asserted. This turns on the access transistor and allows the
capacitor to charge up or
discharge,
depending on the state of the bit line.
During a 'read'
operation, the 'word' line is also asserted, which turns on the access
transistor. The enabled transistor allows the voltage on the
capacitor to be read by a sensitive amplifier circuit through the 'bit'
line. This sense circuit is able to determine whether a '1' or '0' is
stored in the memory cell by comparing the sensed
capacitor voltage
against a threshold, i.e., 50% of the full-charge voltage. Thus, it is a
'1' (charged capacitor) if the charge is still more than 50% and a '0'
(discharged capacitor) if it's less than that.
For DRAMs, the
simple operation of reading the data of a memory cell is destructive to
the stored data. This is because the cell capacitor undergoes
discharging every time it is sensed through the 'bit' line. In fact, the
stored charge in a DRAM cell decays over
time
even if it doesn't undergo a 'read' operation. Thus, in order to preserve
the data in a DRAM cell, it has to undergo what is known as a 'refresh'
operation.
A refresh operation is simply
the process of reading a memory cell's content before it disappears and
then writing it back into the memory cell. Typically it is done
every few milliseconds per word. However, the refresh cycle itself
is very short (in the order of nanoseconds), since a DRAM IC contains
thousands of words that need to be refreshed regularly at that interval.
The need for regular refreshing gave DRAMs the name 'dynamic'.
Aside from its
memory array, a DRAM device also needs to have the following support
circuitries
to accomplish its functions: 1) a decoding circuit for row address and
column address selection; 2) a counter for tracking the refresh operation
sequence; 3) a sense amplifier for reading and restoring the charge of
each cell; and 4) a write enable circuit to put the cell in 'write' mode,
i.e., make it ready to accept a charge.
DRAMs are
mainly used as a computer system's
volume memory,
since they are denser and less costly than SRAM's. However, they are
not suited for speed-sensitive applications such as cache memories since
the dynamic refreshing required by them slows down system operation.
SRAM's are a better choice if speed is a major concern.
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